Processing ServicesFrom Strip to Finished Part
1. Processing Capabilities — in-house & partner lines
All processes support toll processing on your material, or material-plus-processing as one package. Quoted per drawing and alloy temper.
Gold Electroplating
Full / selective / brush plating for SUS, copper alloys and terminals. Thickness 0.06–1.2 mm, width 6–100 mm, accuracy ≤0.01 mm.
Tin Electroplating
Excellent ductility and corrosion resistance, good solderability and conductivity. Uniform film thickness, 24H salt-spray tested.
Silver Electroplating
Anti-corrosion with high electrical and thermal conductivity and excellent solderability. For connectors and hardware in 3C, automotive and appliances.
Electrophoresis
Continuous e-coating line for copper, stainless steel and aluminium. Thickness 0.1–1.5 mm, width 5–280 mm, 4.2 km/day/line.
Etching
Continuous etching line with ±0.05 mm accuracy. Nickel silver, stainless steel and aluminium — ideal for high-volume thin precision parts.
Metal Die-cutting
3KK pcs/day, burr height within ±0.03 mm. SUS304, C7701, C5210, aluminium and more — quoted from your drawing.
Metal Screen Printing
Solvent-based, water-based and other ink systems in black, yellow, grey and more. SUS304, C7701, C5210, aluminium; 4KK pcs/day.
Die-cutting Process
Precision die-cutting for functional die-cut parts — EMI, insulation, cushioning and thermal interface — including complex shapes and multi-layer laminates.
2. Partner Material Lines — shielding & thermal materials
The following materials are supplied through our strategic partner factory (Shenzhen Zhenjin Precision Technology, founded 2010); Qindaoyuan handles selection, quoting and delivery. Quality standards match our own lines: material certified by temper, inspection report with every batch.
Conductive Fabric
Good conductivity and EMI shielding, flexible and fatigue-resistant, adhesive-coated for secondary processing, laminating accuracy ±0.03 mm.
Copper Foil
Reduces operating temperature and battery energy loss, with insulation and anti-radiation benefits. Slitting and adhesive lamination available.
Gold Plating on PI Film
Sputtered Cu/Ni on PI substrate followed by electrolytic plating — EMI shielding, insulated thermal or conductive paths, 200–300 °C continuous.
Thermal Pad
Reduces contact thermal resistance between heat source and heatsink; die-cut down to 1.2×1.6 mm, accuracy ±0.03 mm. For CPU/GPU and heat sinks.
Graphite Sheet
Ultra-thin and light (about 1/3 the weight of aluminium at equal size) with fast point-to-plane heat spreading for slim devices.
Carbon Nanotube
Tensile strength 50–200 GPa with high thermal conductivity and chemical stability, for premium thermal and conductive applications.
Nanocrystalline
Wireless-charging magnetic sheet: high saturation flux and permeability with low loss, suppressing metal reflection and eddy currents.
Ferrite
Resistivity far higher than metallic magnetic materials — suppresses eddy currents at high frequency. Chemically stable and rust-free.
PET Film
White, 110 °C / 30 min heat resistance; flatness <0.15 mm for magnet fixation; accuracy ±0.03 mm, 6K pcs/hour.
Screen Steel Sheet
Accuracy ±0.10 mm with industry-first continuous double-sided adhesive laminating. For phones, laptops, tablets and other electronics.
Send your drawing — material and processing in one quote
In-house slitting and continuous electroplating, plus die-cutting, printing and etching partner lines — fewer vendors for you to manage. Small-lot sampling, salt-spray and solderability testing supported.